eGRAF® Products > HS-400 & SS-500 Fin-Stock Materials

Products

Thermal Management Solutions

click the products below for more information and technical downloads

HS-400 & SS-500 Fin-Stock Materials

Superior performance at 40% of the weight

BONDED FIN HEAT SINK & FIN-STOCK HS-400 & SS-500 Fin-Stock Materials provide

an alternative to thermal engineers when aluminum can no longer meet power dissipation requirements and copper is too heavy. Custom designed to meet the thermal and mechanical demands of each application, HS-400 and SS-500 (developemental product) Fin-Stock materials offer improved performance at a fraction of the weight.

Technical Documents

Features and Benefits

  • 400 to 500 W/m-K Thermal Conductivity
  • Improve thermal performance without increasing weight
  • Reduce overall product weight
  • Designs can extend current fan/sink technologies
  • Improve shock and vibe resistance
  • Will not corrode in common environments
  • Ideal when Power >80W and Fin Height >25mm
  • Ideal for concentrated heat sources
  • Ideal when Aluminum is not effective, Copper is the alternative and weight is critical